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FPC Connectors 0.5mm Pitch

0.50 Pitch 51 Pin 2.1H High Density ZIF SMT FPC connector F05052FA051M1WLJ9

0.50 Pitch 51 Pin 2.1H High Density ZIF SMT FPC connector F05052FA051M1WLJ9

The F05052FA051M1WLJ9 is a high-performance FPC connector engineered for advanced electronic systems, providing a reliable and secure 51-pin interface solution for flexible printed circuits in space-constrained environments.

  • Part Number :

    F05052FA051M1WLJ9
  • Product Category :

    FPC connector

Product Overview

This professional-grade 0.50 Pitch 51 Pin FPC connector features a precision 2.1mm mounting height and a Zero Insertion Force (ZIF) architecture. It utilizes a robust back-flip actuator to eliminate mechanical friction during mating, ensuring long-term signal stability and high retention force for high-density hardware assemblies.

 

Product Specifications / Attributes

  • Pitch: 0.50mm.
  • Pin Count: 51 Positions.
  • Mounting Height: 2.1mm.
  • Housing & Actuator: High-temperature LCP plastic (UL94V-0).
  • Terminal Plating: Phosphor Copper with Gold Flash (1u" Min) in contact areas and Matte Tin (80160u") in solder areas over a 50100u" Nickel underplate.
  • This 2.1H SMT ZIF FPC connector design includes integrated dual grounding plates (left and right) made of copper alloy for enhanced structural anchoring to the PCB.

 

Features&Benefits

  • Secure Mechanical Locking: This SMT Back Flip FPC connector model features a user-friendly flip actuator that provides clear tactile feedback and strong locking for the flexible circuit tail.
  • Superior Signal Quality: Utilizes high-grade metallic contacts and grounding plates to ensure excellent electrical conductivity and reliable EMI protection.
  • Thermal Stability: Constructed with high-temperature liquid crystal polymer (LCP) components capable of withstanding standard industrial lead-free reflow soldering profiles.
  • Industrial Precision: Adheres to strict manufacturing tolerances, including ±0.10mm for critical fine-pitch dimensions, to ensure high assembly yields.

 

Packing Details

If you need detailed information about our packaging specifications and requirements, please feel free to contact us directly. We will be happy to provide you with the details.

 

Applications

  • High-definition LCD and OLED display module interfacing.
  • Smartphones, premium tablets, and ultra-thin laptops.
  • Automotive infotainment systems and digital instrumentation.
  • Medical diagnostic instruments and high-tech wearable devices.
  • Industrial drones and action cameras requiring high-density signal routing.

 

Frequently Asked Questions (FAQ) 

  • Q: What is the plating specification for the terminals of this model?
  • A: The terminals feature 1u" Min Gold plating in the contact area and 80~160u" Matte Tin in the solder area to ensure high-reliability performance for this FPC connector.
  • Q: Does the F05052FA051M1WLJ9 support grounding?
  • A: Yes, it is equipped with left and right copper alloy grounding plates to enhance structural stability and grounding reliability within the assembly.
  • Q: How is this FPC connector protected from environmental degradation before assembly?
  • A: The units are provided in vacuum-sealed packaging to protect the sensitive gold and tin-plated contacts from environmental moisture and oxidation.

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