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FPC Connectors 0.5mm PitchPremium SMT ZIF FPC Connector 0.50mm Pitch 68Pin 2.1mm Height for Display Modules Cameras Industrial Devices F05055FA068M1WLJ9
The F05055FA068M1WLJ9 is a precision SMT FPC connector for high-density board-to-flex cable interconnects. This 68-pin device delivers 0.50mm pitch, 2.1mm low-profile height, and ZIF flip-cover actuation for reliable signal transmission in compact electronic assemblies.
Part Number :
F05055FA068M1WLJ9Product Category :
FPC connectorProduct Overview
This ZIF FPC connector provides secure board-to-flexible-cable mating with a 0.50mm pitch and 68-pin configuration. The 2.1mm low-profile design incorporates flip-cover actuation, matte tin contact plating, and left/right ground tabs for stable signal integrity in display and camera interconnects.
Product Specifications
Engineered as a precision 0.50mm pitch FPC connector with 68-pin ZIF configuration and 2.1mm height, the F05055FA068M1WLJ9 delivers the following performance parameters:
|
Product Type |
ZIF FPC Connector (SMT) |
|
Pitch |
0.50 mm |
|
Pin Count |
68 Pins |
|
Height |
2.1 mm |
|
Overall Length (DIM A) |
41.00 mm |
|
Body Width (DIM B) |
33.50 mm |
|
Contact Pitch Span (DIM D) |
38.10 mm |
|
FPC Slot Span (DIM E) |
36.60 mm |
|
Current Rating |
0.5 A / 50 V AC/DC |
|
Contact Resistance |
30 mΩ Max |
|
Insulation Resistance |
100 MΩ Min @ 500 V DC |
|
Withstanding Voltage |
500 V AC/minute |
|
Operating Temperature |
-40°C to +85°C |
|
Insulator Material |
LCP Plastic, UL 94V-0 (Black) |
|
Contact Material |
Copper Alloy, Tin-Gold Plated (80~160 µin) |
|
RoHS Compliance |
Yes |
Features&Benefits
Engineered as a high-reliability SMT FPC connector with ZIF flip-cover actuation, the F05055FA068M1WLJ9 provides these key advantages:
· 0.50mm Fine Pitch Design: Provides high-density signal routing for compact PCB layouts in portable display panels, camera modules, and wearable electronics with tight interconnect spacing.
· ZIF Flip-Cover Actuation: Zero insertion force protects delicate FFC/FPC cables during mating and unmating, extending socket lifespan and ensuring consistent contact engagement without frictional wear on contact surfaces.
· 2.1mm Low-Profile Height: Compact vertical footprint optimizes board space in slim display modules, imaging assemblies, and portable enclosures with strict mechanical clearance limits.
· Matte Tin Contact Plating: Delivers reliable solderability and stable contact resistance through automated SMT reflow processes and varied operating environments, supporting long-term signal integrity.
· Integrated Ground Tabs: Left and right ground tabs enhance EMI shielding and mechanical stability for the flex interconnect in noise-sensitive applications requiring robust signal integrity.
Packing Details
If you need detailed information about our packaging specifications and requirements, please feel free to contact us directly. We will be happy to provide you with the details.
Applications
· Smartphone and tablet display panel interconnects with high-density flex cable routing in compact portable device housings
· Digital camera and imaging sensor modules using ZIF flex sockets for reliable signal transmission in slim form factors
· Laptop, ultrabook, and convertible PC internal display and touchscreen ribbon cable connections with tight internal clearances
· Industrial HMI panels and handheld diagnostic equipment display interface boards requiring stable board-to-flex connectivity
· Wearable devices, AR/VR modules, and IoT sensor boards needing low-profile flex cable interconnects for miniaturized designs
Frequently Asked Questions (FAQ)
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