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USB 3.1 Type-C Connector 24Pin SMT Horizontal Receptacle UC22-1A1H1E003-0HR-27(Cross out MOLEX 2171760001)

USB 3.1 Type-C Connector 24Pin SMT Horizontal Receptacle UC22-1A1H1E003-0HR-27(Cross out MOLEX 2171760001)

The UC22-1A1H1E003-0HR-27 is a USB 3.1 Type-C Connector receptacle featuring a 24-pin surface-mount horizontal design with through-hole shell anchoring.

Engineered for SuperSpeed USB 3.1 Gen 1 data rates up to 5 Gbps, this full-featured female connector provides reversible plug orientation, USB Power Delivery support, and 10,000-cycle durability for consumer electronics, mobile devices, and peripheral equipment.

  • Part Number :

    UC22-1A1H1E003-0HR-27

  • Product Category :

    USB Type-C Connector
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Product Overview

The USB 3.1 Type-C Connector model UC22-1A1H1E003-0HR-27 is a 24-pin surface-mount horizontal receptacle offering all 24 Type-C contact positions in a compact SMT-compatible package. The connector supports USB 3.1 Gen 1 SuperSpeed data at 5 Gbps with backward compatibility for USB 2.0 and USB 1.1 protocols.

The horizontal mounting configuration with shell stake pins provides robust mechanical anchoring, while the stainless steel mid-plate delivers structural reinforcement and EMI isolation between upper and lower contact rows.

Gold-plated phosphor bronze contacts, LCP UL94 V-0 housing, and a rated 10,000 mating cycles make this connector a durable solution for high-reliability USB Type-C interface designs in consumer, industrial, and automotive applications.

 

Product Specifications / Attributes

 

Attribute

Value

Product Model

UC22-1A1H1E003-0HR-27

Manufacturer

VITALCONN Electronics

Connector Category

24 pin horizontal USB Type-C Connector

Connector Type

USB Type-C Receptacle (Female)

USB Specification

USB 3.1 Gen 1 (SuperSpeed, 5 Gbps)

Number of Contacts

24 (Full-Featured Type-C)

Mounting Style

Surface Mount Horizontal (SMT + Shell Stake)

Insertion Orientation

Reversible (Both Directions)

Contact Material

Phosphor Bronze, Gold-Plated (30u min)

Shell Material

Stainless Steel, Nickel-Plated

Mid-Plate Material

Stainless Steel

Housing Material

LCP (Liquid Crystal Polymer), UL94 V-0

Rated Current

5 A (VBUS), 1.25 A (VBUS)

Withstanding Voltage

100 V AC (1 minute)

Contact Resistance

≤ 40 mΩ (initial)

Insulation Resistance

≥ 100 MΩ at 100 V DC

Mating Cycles

≥ 10,000 cycles

Operating Temperature

-40 to +85 °C

RoHS Compliance

Yes
 

Features&Benefits

  • SuperSpeed USB 3.1 Gen 1 Performance: Supports 5 Gbps data transfer rates with backward compatibility for USB 2.0 (480 Mbps) and legacy USB standards, enabling universal connectivity across multiple device generations.
  • 24-Pin Full-Featured Type-C Interface: Complete 24-contact configuration provides all necessary signal pins for SuperSpeed data lanes, USB 2.0, sideband use (SBU1/SBU2), and configuration channels (CC1/CC2).
  • Dual-Orientation Reversible Design: Symmetric contact layout eliminates connector orientation concerns, allowing users to insert USB Type-C plugs in either direction without alignment issues.
  • 10,000-Cycle Durability Rating: High-cycle endurance ensures long service life in frequently-connected applications such as smartphones, laptops, and docking stations.
  • Surface Mount with Through-Hole Anchors: SMT contact pads enable efficient automated assembly, while through-hole shell stakes provide superior mechanical retention against lateral forces.
  • Stainless Steel Mid-Plate Shield: Internal mid-plate construction enhances structural integrity, reduces crosstalk between upper and lower contact rows, and improves insertion force consistency.
  • Gold-Plated Contact Surfaces: 30 micro-inch minimum gold plating on phosphor bronze contacts ensures stable low-resistance electrical performance and corrosion resistance over the full rated operating life.
  • SMT Assembly Ready: Compatible with industry-standard pick-and-place equipment and lead-free reflow soldering processes, with LCP housing rated for peak reflow temperatures.

 

Packing Details

If you need detailed information about our packaging specifications and requirements, please feel free to contact us directly. We will be happy to provide you with the details.

 

Applications

  • Consumer electronics mobile device USB-C ports
  • Laptop and notebook computer mainboard USB-C connectors
  • USB-C hubs, docking stations, and multi-port adapters
  • Portable storage and external SSD interface connectors
  • Wearable device and hearable charging/data ports
  • Industrial embedded systems and panel-mount USB-C interfaces
  • In-vehicle USB charging and data connectivity ports

 

Frequently Asked Questions (FAQ) 

  • Q: What soldering profile is recommended for the UC22-1A1H1E003-0HR-27 SMT USB Type-C Connector?
  • A: The UC22-1A1H1E003-0HR-27 is compatible with standard lead-free reflow soldering profiles with a peak temperature of up to 260 °C per JEDEC J-STD-020. The LCP housing material is rated to withstand these temperatures without deformation. For the through-hole shell stakes, wave soldering or selective soldering can be used. A solder paste stencil thickness of 0.10-0.12 mm is recommended for the SMT contact pads.
  • Q: Is the UC22-1A1H1E003-0HR-27 USB Type-C Connector compatible with Thunderbolt 3/4?
  • A: The UC22-1A1H1E003-0HR-27 is a USB 3.1 Gen 1 Type-C connector rated for 5 Gbps operation. Thunderbolt 3/4 requires 40 Gbps bandwidth and uses different signal integrity requirements at 20 Gbps per lane. While the physical Type-C connector interface is mechanically compatible with Thunderbolt plugs, achieving full Thunderbolt certification requires connectors specifically qualified for the higher-frequency 10-20 Gbps differential signaling. Please consult VITALCONN for Thunderbolt-compatible Type-C connector recommendations if required.
  • Q: How should the UC22-1A1H1E003-0HR-27 24 pin USB Type-C Connector be stored before assembly?
  • A: The UC22-1A1H1E003-0HR-27 should be stored in its original moisture-barrier bag at temperatures below 30 °C and relative humidity below 60%. Once the moisture-barrier bag is opened, components should be assembled within the floor life specified by the MSL rating (typically MSL 3). If the floor life is exceeded, a baking process per IPC/JEDEC J-STD-033 may be required before reflow soldering. Please refer to the product packaging label for the exact MSL rating.

Hot Tags :

USB 3.1 Type-C Connector

24 pin horizontal USB Type-C Connector

SMT receptacle USB Type-C Connector

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