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Consumer Connectors FPC Connectors 0.5mm Pitch

ZIF FPC Connector 0.5mm Pitch 68 Pin SMT Low Profile F05053FA068M1WLJ9

ZIF FPC Connector 0.5mm Pitch 68 Pin SMT Low Profile F05053FA068M1WLJ9

The F05053FA068M1WLJ9 is a high-density 68-position ZIF FPC connector engineered for space-constrained flexible printed circuit applications. Designed with a fine 0.50mm contact pitch, this surface-mount connector delivers reliable electrical interconnection between FPC/FFC cables and PCB boards in compact electronic devices.

The zero insertion force actuation mechanism allows easy cable insertion and extraction while maintaining secure contact retention, making it an ideal 68-Pin ZIF FPC Connector 0.5mm Pitch solution for consumer electronics, mobile devices, and industrial embedded systems.

  • Part Number :

    F05053FA068M1WLJ9
  • Product Category :

    FPC connector

Product Overview

This F05053FA068M1WLJ9 is a 68-pin ZIF-type FPC connector featuring a 0.50mm ultra-fine pitch and a low 2.1mm assembled height, making it a highly compact 68-Pin ZIF FPC Connector 0.5mm Pitch for next-generation slim-profile designs.

The connector body is molded from high-temperature LCP (Liquid Crystal Polymer) thermoplastic for excellent thermal stability and SMT reflow compatibility. The flip-lock actuator design enables tool-free cable insertion and removal, while dual ground tabs provide enhanced EMI shielding and mechanical anchoring to the PCB.

Phosphor copper contacts with selective gold plating on the mating area ensure low contact resistance and long-term reliability across repeated actuation cycles.

 

Product Specifications / Attributes

ZIF (Zero Insertion Force) FPC/FFC Connector


Connector Type

ZIF (Zero Insertion Force) FPC/FFC Connector

Number of Positions

68 Pin

Contact Pitch

0.50 mm

Connector Height

2.1 mm (Assembled)

Mounting Type

Surface Mount (SMT)

Contact Material

Phosphor Copper — Gold Plated (1 µ" Min on Contact Area)

Contact Plating

Matte Tin 80~160 µ" on Solder Tails; Nickel Underplate 50~100 µ"

Housing Material

LCP (Liquid Crystal Polymer), UL 94V-0

Actuator Material

LCP, Flip-Lock (Black / White)

Ground Tab Material

Copper Alloy, Matte Tin Plated

Current Rating

0.5 A per Contact

Voltage Rating

50 V AC/DC

Contact Resistance

30 mΩ Max (Initial)

Insulation Resistance

100 MΩ Min at 500 V DC

Dielectric Withstanding Voltage

250 V AC for 1 Minute

Operating Temperature Range

-40°C to +85°C

Mating Cycles (Durability)

20 Cycles

RoHS Compliance

Yes, Lead-Free

Packaging

Tape & Reel; Vacuum Sealed

Recommended FFC Thickness

0.30 ± 0.05 mm

 

 

Features&Benefits

Ultra-Fine 0.50mm Pitch providing key advantages.

  • Ultra-Fine 0.50mm Pitch: Enables high-density 68-pin interconnect in a compact footprint, ideal for miniaturized consumer and mobile electronics requiring an SMT Low Profile Flexible Printed Circuit Connector.
  • ZIF Flip-Lock Actuator: Zero insertion force mechanism allows effortless FPC/FFC cable insertion and secure retention without tools, reducing assembly time and preventing contact damage.
  • Low 2.1mm Profile: Slim height design maximizes PCB stacking efficiency in thin devices such as tablets, ultrabooks, and wearable electronics.
  • Gold-Plated Phosphor Copper Contacts: Provide superior conductivity, corrosion resistance, and stable contact resistance over the rated mating life.
  • High-Temperature LCP Housing: Withstands peak reflow soldering temperatures, compatible with lead-free SMT assembly processes.
  • Dual Ground Tabs: Integrated left and right grounding pads enhance EMI shielding performance and improve mechanical retention strength to the PCB.
  • Vacuum Sealed Packaging: Protects connectors from moisture and contamination during storage and transportation, ensuring pick-and-place compatibility.
  • RoHS and REACH Compliant: Manufactured under environmentally responsible processes meeting global regulatory requirements.

 

 

Packing Details

If you need detailed information about our packaging specifications and requirements, please feel free to contact us directly. We will be happy to provide you with the details.

 

Applications

  • Smartphones and tablet PCs — display and camera FPC interconnects
  • Wearable devices and smart watches — compact internal flex circuit routing
  • Laptop and ultrabook internal module connections
  • LCD/LED display panel driver board interfaces
  • Digital cameras and portable imaging devices
  • Industrial handheld terminals and portable instrumentation
  • Automotive infotainment and dashboard display systems
  • Medical portable diagnostic equipment

 

Frequently Asked Questions (FAQ) 

  • Q: What is the contact pitch of the F05053FA068M1WLJ9 ZIF FPC connector and what FFC cable does it accept?
  • A: The F05053FA068M1WLJ9 features a 0.50mm contact pitch and is designed to mate with 68-conductor FFC/FPC cables with a thickness of 0.30 ± 0.05mm. The ZIF flip-lock actuator securely clamps the cable after insertion for reliable electrical contact.
  • Q: What is the recommended soldering profile for this Gold Plated Phosphor Copper FPC Socket?
  • A: The connector is designed for lead-free reflow soldering. The high-temperature LCP housing withstands peak reflow temperatures up to 260°C as per JEDEC J-STD-020 standards. Solder paste printing on the 0.50mm pitch pads should follow standard fine-pitch SMT guidelines. Please refer to the product drawing DWG VTC-TZ-J9-013 for the recommended land pattern.
  • Q: How many mating cycles can the F05053FA068M1WLJ9 withstand?
  • A: The connector is rated for a minimum of 20 mating cycles under normal operating conditions. The gold-plated phosphor copper contacts and robust LCP actuator design ensure consistent contact performance throughout the rated cycle life.

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