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FPC Connectors 0.5mm Pitch

SMT ZIF FPC Connector – 0.50mm Pitch, 60-Pin, 2.1mm Height for Display Modules, Cameras & Consumer Electronics F05055FA060M1WLJ9

SMT ZIF FPC Connector – 0.50mm Pitch, 60-Pin, 2.1mm Height for Display Modules, Cameras & Consumer Electronics F05055FA060M1WLJ9

The F05055FA060M1WLJ9 is an SMT FPC connector designed for compact board-to-flex interconnection. This 60-pin device features 0.50mm pitch, 2.1mm height, and ZIF flip-cover actuation for dependable signal transmission in space-constrained electronic assemblies requiring precision connectivity and stable performance in portable consumer device manufacturing applications.

  • Part Number :

    F05055FA060M1WLJ9
  • Product Category :

    FPC connector

Product Overview

This SMT FPC connector provides reliable board-to-flexible-cable mating with a 0.50mm pitch and 60-pin configuration. The 2.1mm low-profile ZIF design incorporates flip-cover actuation, matte tin contact plating, and integrated ground tabs for stable signal integrity in consumer electronics, display modules, imaging devices, and portable equipment applications requiring dependable high-density connectivity solutions and consistent electrical performance in automated printed circuit board assembly processes.

 

Product Specifications 

 

Attribute

Value

Product Model

F05055FA060M1WLJ9

Product Type

ZIF FPC Connector

Number of Pins

60

Pitch

0.50mm

Connector Height

2.1mm

Actuation Type

Flip Cover (ZIF)

Mounting Type

SMT (Surface Mount Technology)

Contact Plating

Matte Tin

Ground Tab

Yes (Left & Right)

FCN Code

J9

Packaging

Vacuum Sealed

Unit

mm


 

Features&Benefits

· 0.50mm Fine Pitch Design: Enables high-density signal routing in compact PCB layouts for portable consumer electronic devices requiring space-efficient interconnect solutions and reliable performance in miniaturized product designs.

· ZIF Flip-Cover Actuation: Zero insertion force mechanism protects FFC cables during mating and unmating cycles, extending connector lifespan and maintaining consistent contact engagement reliability without frictional surface wear.

· 2.1mm Low-Profile Height: Space-saving vertical design optimizes board area in thin display modules, compact imaging assemblies, and portable device enclosures with tight mechanical clearances and slim profiles.

· Matte Tin Contact Plating: Provides reliable solderability and stable contact resistance across various operating conditions and environments, supporting long-term performance and durability in automated assembly processes.

· Integrated Ground Tabs: Left and right ground tabs deliver EMI shielding and mechanical stability for flex connector applications in noise-sensitive electronic systems and portable device designs.

 

Packing Details

If you need detailed information about our packaging specifications and requirements, please feel free to contact us directly. We will be happy to provide you with the details.

 

Applications

· Smartphone and tablet display panel interconnects requiring compact flex cable connectivity in thin portable form factors and lightweight electronic device designs with tight internal spatial constraints

· Digital camera and image sensor modules with space-efficient ZIF connector footprints for reliable signal routing and consistent data transmission performance in portable imaging devices

· Laptop and ultrabook internal display and touchscreen ribbon cable interface connections in slim and lightweight portable computing device assemblies with limited internal vertical clearance

· Portable medical devices and handheld diagnostic equipment display interface board assemblies requiring dependable board-to-flex connectivity in compact housings and ruggedized portable enclosures

· Consumer electronics and IoT modules needing low-profile board-to-flex interconnection solutions for compact designs and space-constrained product enclosures in high-volume manufacturing environments

 

Frequently Asked Questions (FAQ) 

Q: What is the pitch and pin count of the F05055FA060M1WLJ9?

A: The F05055FA060M1WLJ9 features a 0.50mm pitch with 60 pins in a ZIF configuration. The 2.1mm height and flip-cover actuation make it suitable for display and camera module interconnection in compact consumer electronic devices requiring reliable board-to-flex connectivity.

The matte tin contact plating ensures consistent solderability, while the integrated ground tabs provide enhanced EMI shielding for stable signal transmission across repeated mating cycles in demanding portable and consumer electronic device applications.

Q: How does the flip-cover ZIF mechanism protect the cable?

A: The flip-cover actuation enables zero-insertion-force mating by opening the cover, inserting the FFC cable to the specified depth, and closing it to engage contacts. This prevents cable damage during insertion and removal, ensuring reliable signal transmission across multiple mating cycles.

The zero-insertion-force design eliminates frictional wear on contact surfaces, extending connector lifespan and maintaining consistent electrical performance in portable and consumer electronic device applications requiring frequent cable connection and disconnection operations.

Q: What devices use this connector type?

A: This connector is used in smartphone displays, digital camera modules, laptop internal panels, portable medical devices, and IoT electronics. The 0.50mm pitch and 60-pin configuration provide efficient interconnection for space-constrained consumer and portable electronic device applications requiring dependable signal integrity.

The compact 2.1mm profile and SMT mounting format enable efficient PCB assembly in automated manufacturing processes, making it suitable for high-volume production of display modules, imaging systems, and portable electronic devices where board space optimization and reliable flex cable connectivity are critical design requirements.

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