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Consumer Connectors FPC Connectors 1.0mm PitchZIF FPC Connector 0.50mm Pitch 51-Pin 2.1mm Height SMT Flip-Lock F05059FA051M1WLJ9
The F05059FA051M1WLJ9 is a 51-pin ZIF (Zero Insertion Force) FPC connector with 0.50mm pitch and 2.1mm mated height, designed for the J9 flip-lock actuator series.
This high-pin-count ZIF FPC connector supports high-density flexible circuit interconnects required in compact embedded modules, multi-channel sensor interfaces, and slim consumer electronics, with gold-flash contact plating for reliable low-resistance signal paths.
Part Number :
F05059FA051M1WLJ9Product Category :
FPC connectorProduct Overview
This 0.50mm pitch 51-pin ZIF FPC connector delivers the high contact density required for wide-bus parallel interfaces such as LVDS display panels, multi-sensor data acquisition modules, and high-density custom FPC cable harnesses.
The J9 series flip-lock mechanism provides positive cable retention with zero-insertion-force assembly, and the 2.1mm mated height profile minimizes board-to-board stack height in thin chassis designs.
Product Specifications / Attributes
|
Parameter |
Value |
|
Part Number |
F05059FA051M1WLJ9 |
|
Contact Pitch |
0.50mm |
|
Number of Contacts |
51 Pins |
|
Mated Height |
2.1mm |
|
Actuator Type |
J9 Flip-Lock (Back-Flip) |
|
Contact Plating (Contact Zone) |
Gold Flash ≥1µ" over Nickel 50~100µ" |
|
Contact Plating (Solder Area) |
Matte Tin 80~160µ" |
|
Housing Material |
LCP (Liquid Crystal Polymer) — Black |
|
FPC Insertion Direction |
Bottom Contact |
|
PCB Mounting |
SMT (Surface Mount) |
|
Operating Temperature |
-40°C to +85°C |
|
Drawing Number |
VTC-TZ-J9-018 |
|
RoHS |
Compliant |
Features&Benefits
● 0.50mm pitch 51-pin configuration achieves the highest contact density for wide-bus and multi-channel FPC cable connections
● J9 flip-lock ZIF actuator ensures consistent contact force with zero insertion force for reliable low-damage cable assembly
● Gold flash plating on contact zones provides stable electrical interface resistance for high-speed parallel data transmission
● 2.1mm mated height supports ultra-slim PCB assembly requirements in thin tablet and notebook module designs
● LCP housing provides dimensional stability under IR reflow soldering and long-term thermal cycling conditions
● Compatible with grounded and non-grounded FPC cable types with aluminum foil shielding options
Packing Details
If you need detailed information about our packaging specifications and requirements, please feel free to contact us directly. We will be happy to provide you with the details.
Applications
● LVDS and eDP display panel FPC ribbon cable connections in tablets and laptops
● Multi-channel sensor array and MEMS device flexible circuit board connections
● Camera module and image signal processor (ISP) high-density FPC interconnects
● Industrial handheld device touchscreen and digitizer FPC connections
● High-density data acquisition module parallel bus FPC interfaces
● Embedded vision module and AI accelerator board flexible cable connections
Frequently Asked Questions (FAQ)
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