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FPC Connectors 0.5mm PitchSMT ZIF FPC Connector – 0.50mm Pitch, 96-Pin, 2.1mm Height for Display Modules, Cameras & Industrial Devices F05054FA096M1WLJ9
The F05054FA096M1WLJ9 is an SMT FPC connector engineered for high-density board-to-flex interconnection. This 96-pin device features 0.50mm pitch, 2.1mm height, and ZIF flip-cover actuation for reliable signal transmission in compact electronic assemblies requiring precision connectivity and stable performance in portable consumer device manufacturing applications.
Part Number :
F05054FA096M1WLJ9Product Category :
FPC connector
Product Overview
This SMT FPC connector delivers secure board-to-flexible-cable mating with a 0.50mm pitch and 96-pin configuration. The 2.1mm low-profile ZIF design features flip-cover actuation, matte tin contact plating, and integrated ground tabs for stable signal integrity in consumer electronics, display modules, camera assemblies, and portable device interconnection applications requiring reliable high-density connectivity and consistent electrical performance in automated printed circuit board assembly processes.
Product Specifications
|
Attribute |
Value |
|
Product Model |
F05054FA096M1WLJ9 |
|
Product Type |
ZIF FPC Connector |
|
Number of Pins |
96 |
|
Pitch |
0.50mm |
|
Connector Height |
2.1mm |
|
Actuation Type |
Flip Cover (ZIF) |
|
Mounting Type |
SMT (Surface Mount Technology) |
|
Contact Plating |
Matte Tin |
|
Ground Tab |
Yes (Left & Right) |
|
FCN Code |
J9 |
|
Packaging |
Vacuum Sealed |
|
Unit |
mm |
Features&Benefits
· 0.50mm Fine Pitch Design: Enables high-density signal routing in space-constrained PCB layouts for portable and wearable electronic devices requiring compact interconnect solutions and optimized board area utilization in miniaturized product designs.
· ZIF Flip-Cover Actuation: Zero insertion force mechanism protects delicate FFC cables during mating and unmating cycles, extending connector lifespan and ensuring reliable contact engagement without frictional wear on contact surfaces.
· 2.1mm Low-Profile Height: Compact vertical footprint optimizes board space in ultra-thin display modules, camera assemblies, and portable device enclosures with tight mechanical clearances and slim form factor requirements.
· Matte Tin Contact Plating: Ensures reliable solderability and consistent contact resistance across operating conditions, supporting stable long-term performance in various environmental exposures and automated assembly processes.
· Integrated Ground Tabs: Left and right ground tabs provide enhanced EMI shielding and mechanical stability for flex connector applications in noise-sensitive electronic systems requiring superior signal integrity.
Packing Details
If you need detailed information about our packaging specifications and requirements, please feel free to contact us directly. We will be happy to provide you with the details.
Applications
· Smartphone and tablet display module interconnects requiring high-density flex cable connectivity in compact portable form factors and lightweight electronic device designs
· Digital camera and imaging sensor assemblies with compact ZIF connector footprints for reliable signal routing and consistent data transmission in portable imaging devices
· Laptop and convertible PC internal display and touch panel ribbon cable connections in thin and lightweight portable computing device assemblies with tight internal clearances
· Industrial HMI panels and portable diagnostic equipment display interface board assemblies requiring dependable board-to-flex connectivity in demanding operating environments
· Wearable devices and IoT sensor modules requiring low-profile board-to-flex interconnection solutions for compact and lightweight product designs with space-constrained enclosures
Frequently Asked Questions (FAQ)
Q: What is the pitch and pin count of the F05054FA096M1WLJ9?
A: The F05054FA096M1WLJ9 features a 0.50mm pitch with 96 pins in a ZIF configuration. The 2.1mm height and flip-cover actuation make it suitable for high-density display and camera module interconnection in portable electronic devices requiring reliable board-to-flex connectivity.
The matte tin contact plating ensures consistent solderability, while the integrated ground tabs provide enhanced EMI shielding for stable signal transmission across repeated mating cycles in demanding portable and consumer electronic device applications.
Q: How does the ZIF flip-cover mechanism work?
A: The flip-cover actuation allows zero-insertion-force mating by opening the cover, inserting the FFC cable to the specified depth, and closing it to secure contact. This protects delicate flex cables from damage during insertion and removal, ensuring reliable signal transmission across repeated mating cycles.
The zero-insertion-force design eliminates frictional wear on contact surfaces, extending connector lifespan and maintaining consistent electrical performance in portable and consumer electronic device applications requiring frequent cable connection and disconnection.
Q: What applications is this connector designed for?
A: This connector is designed for smartphone displays, digital camera modules, laptop internal panels, industrial HMI screens, and wearable devices. The 0.50mm pitch and 96-pin count provide high-density interconnection for space-constrained portable and consumer electronics applications requiring dependable signal integrity.
The compact 2.1mm profile and SMT mounting format enable efficient PCB assembly in automated manufacturing processes, making it ideal for high-volume production of display modules, imaging systems, and portable electronic devices where board space optimization and reliable flex cable connectivity are essential design requirements.
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This precision-engineered FPC connector is a specialized high-density interface solution designed to provide a secure and low-profile electrical connection between flexible printed circuits and main circuit boards.
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This high-precision FPC connector is a specialized high-density interface solution designed to provide a secure and low-profile electrical connection between flexible printed circuits and main circuit boards.
Read More
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