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Consumer Connectors FPC Connectors 0.5mm PitchZIF FPC Connector 1.00mm Pitch 30-Pin 2.1mm Height SMT Flip-Lock F10040FA030M1WLJ9
The F10040FA030M1WLJ9 is a 30-pin ZIF (Zero Insertion Force) FPC connector with 1.00mm pitch and 2.1mm mated height, engineered for the J9 flip-lock actuator series.
This ZIF FPC connector features gold-flashed contacts on a tin-plated solder tail, nickel-underplated contact zones for reliable conductivity, and a low-profile black housing suitable for compact PCB designs in mobile, wearable, and embedded display module applications.
Part Number :
F10040FA030M1WLJ9Product Category :
FPC connector
Product Overview
This 1.00mm pitch 30-pin ZIF FPC connector offers a 2.1mm mated height profile to meet the space requirements of thin consumer electronics and embedded module designs.
The J9 series flip-lock actuator mechanism provides tool-free, one-hand cable insertion and secure retention, ensuring consistent contact resistance over thousands of mating cycles. Gold flash plating on the contact area ensures low and stable interface resistance for high-frequency signal integrity.
Product Specifications / Attributes
|
Parameter |
Value |
|
Part Number |
F10040FA030M1WLJ9 |
|
Contact Pitch |
1.00mm |
|
Number of Contacts |
30 Pins |
|
Mated Height |
2.1mm |
|
Actuator Type |
J9 Flip-Lock (Back-Flip) |
|
Contact Plating (Contact Zone) |
Gold Flash ≥1µ" over Nickel 50~100µ" |
|
Contact Plating (Solder Area) |
Matte Tin 80~160µ" |
|
Housing Material |
LCP (Liquid Crystal Polymer) — Black |
|
FPC Insertion Direction |
Bottom Contact |
|
PCB Mounting |
SMT (Surface Mount) |
|
Operating Temperature |
-40°C to +85°C |
|
Drawing Number |
VTC-TZ-J9-017 |
|
RoHS |
Compliant |
Features&Benefits
● 1.00mm pitch 30-pin ZIF FPC connector design accommodates high-density flexible cable routing in thin-profile PCB assemblies
● J9 flip-lock actuator enables zero-insertion-force FPC cable insertion, reducing assembly time and eliminating contact damage risk
● Gold flash contact plating provides stable low-resistance interface for high-frequency signal transmission
● 2.1mm mated height facilitates ultra-slim device profiles in mobile handsets, wearables, and embedded modules
● LCP housing material withstands IR reflow soldering temperatures and maintains dimensional stability
● Nickel underplating on contact zones enhances wear resistance over repeated mating cycles
Packing Details
If you need detailed information about our packaging specifications and requirements, please feel free to contact us directly. We will be happy to provide you with the details.
Applications
● LCD and OLED display module connections in mobile phones and tablets
● Camera module and image sensor FPC board-to-board interconnects
● Wearable device PCB to flexible display ribbon cable connections
● Embedded computing module LCD interface connectors
● Automotive infotainment display FPC connection applications
● IoT device touchscreen and e-ink display signal routing
Frequently Asked Questions (FAQ)
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