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RF Adapter&Cable Assembly Solderless RF Connector

SMT Solderless RF Connector – DC to 110GHz for Aerospace & mmWave Measurement 1.0-KFD01-SMT

SMT Solderless RF Connector – DC to 110GHz for Aerospace & mmWave Measurement 1.0-KFD01-SMT

The 1.0-KFD01-SMT Solderless RF Connector provides ultra-high-frequency board interconnection without soldering. Designed for DC to 110GHz operation with 50 Ohm impedance and VSWR of 1.5 or less, it supports advanced millimeter-wave applications.

This connector is ideal for aerospace test systems, 5G mmWave R&D, and precision measurement equipment requiring reliable solderless RF transition in high-frequency environments.

  • Part Number :

    1.0-KFD01-SMT
  • Product Category :

    rf adapter & cable assembly

Product Overview

The 10mm Solderless RF Connector model 1.0-KFD01-SMT from VITALCONN delivers compression-mount RF connectivity for 1.0mm applications up to 110GHz.

Constructed with a stainless steel body, beryllium copper contacts, and PEI dielectric, it maintains stable electrical characteristics without solder-induced thermal damage. This connector is ideal for high-frequency test boards, aerospace systems, and advanced communication research requiring precision solderless interconnection.

 

Product Specifications / Attributes

Attribute

Value

Product Model

1.0-KFD01-SMT

Manufacturer

VITALCONN Electronics

Product Category

110GHz Solderless RF Connector

Connector Interface

1.0mm Female

Attachment Method

Compression Mount (Solderless)

Characteristic Impedance

50 Ohm

Frequency Range

DC ~ 110 GHz

VSWR

1.5 Max (DC to 110 GHz)

Body Material

Stainless Steel

Contact Material

Beryllium Copper

Dielectric Material

PEI

Operating Temperature

-55 to +125 C

RoHS Compliance

Yes



Features&Benefits

  • · Solderless Compression Mount: Eliminates thermal stress on PCB substrates and preserves high-frequency board structures
  • · DC to 110GHz Bandwidth: Ultra-wide frequency coverage for advanced millimeter-wave and sub-THz test applications
  • · SMT Solderless RF Connector: Compression design enables rapid board reconfiguration and repeated mounting cycles
  • · Stainless Steel Body: Excellent mechanical durability and corrosion resistance for long service life
  • · Beryllium Copper Contacts: Low contact resistance ensures stable signal integrity at millimeter-wave frequencies
  • · PEI Dielectric: Consistent 50 Ohm impedance with minimal dielectric loss up to 110GHz operation

 

Packing Details

If you need detailed information about our packaging specifications and requirements, please feel free to contact us directly. We will be happy to provide you with the details.

 

Applications

  •  110GHz test fixtures and ultra-high-frequency evaluation boards
  • ·Vector network analyzer boards and precision calibration platforms
  • ·Aerospace and defense communication system RF interconnects
  • ·5G millimeter-wave and 6G research and development systems
  • ·Radar front-end module testing and signal path verification
  • ·Satellite payload testing and space communication subsystems
  • ·Advanced RF research laboratory test and measurement setups
  •  Quantum sensing and advanced scientific instrument RF connection

 

Frequently Asked Questions (FAQ) 

Q: What frequency range does the 1.0-KFD01-SMT support?

A: The 1.0-KFD01-SMT supports DC to 110GHz operation with 50 Ohm impedance and a maximum VSWR of 1.5. This makes it suitable for ultra-high-frequency test fixtures, aerospace systems, and advanced millimeter-wave research applications.

Q: What is the VSWR performance of this Solderless RF Connector?

A: This Solderless RF Connector delivers a VSWR of 1.5 or less across the full DC to 110GHz frequency range, ensuring accurate signal transmission for precision measurement and high-frequency test applications.

Q: Can the 1.0-KFD01-SMT be reused across multiple test boards?

A: Yes, the compression-mount solderless design allows the 1.0-KFD01-SMT to be remounted and reconfigured across multiple test boards without soldering. This enables rapid prototyping and repeated assembly without degrading signal integrity.

 

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